Apparatus for degolding or tinning conductive portions of a micr

Metal fusion bonding – Specialized pot

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Details

228 36, 118423, 118429, B23K 306

Patent

active

053722930

ABSTRACT:
The apparatus is used for processing a microelectronic device having a face with electrically conductive elements arranged thereon. The apparatus comprises a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, and drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl. The bowl has an upper rim with an upwardly directed acute angled edge extending therealong.

REFERENCES:
patent: 3269633 (1966-08-01), Bernier et al.
patent: 3359132 (1967-12-01), Wittmann
patent: 5024366 (1991-06-01), Kim

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