Apparatus for cutting substrate and method using the same

Details Apparatus for cutting substrate and method using the same Apparatus for cutting substrate and method using the same

2005-10-11

2009-12-29

Paik, Sang Y (Department: 3742)

Electric heating

Metal heating

By arc

C219S121730

Reexamination Certificate

active

07638729

ABSTRACT:
An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.

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Communication from German Patent Office dated Jun. 12, 2006.

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