Apparatus for cutting substrate and method thereof

Details Apparatus for cutting substrate and method thereof Apparatus for cutting substrate and method thereof

2011-08-09

2011-08-09

Lee, Laura M. (Department: 3724)

Cutting

Other than completely through work thickness or through work...

Scoring

C083S886000, C225S002000, C225S096500

Reexamination Certificate

active

07992482

ABSTRACT:
An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.

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