Apparatus for cutting semiconductor crystal

Details Apparatus for cutting semiconductor crystal Apparatus for cutting semiconductor crystal

1988-07-25

1990-11-20

Bell, Paul A.

Stone working

Sawing

Rotary

125 1302, 8352215, 8352216, B23Q 1709

Patent

active

049710214

ABSTRACT:
An apparatus for cutting a semiconductor crystal ingot into wafers includes a rotary blade, a first sensor, a second sensor and a computing unit. The blade is of a generally disk shape having a mark put thereon. The first sensor is stationarily located in opposed relation to the blade for sensing a distance between the blade and the first sensor to produce a first signal representative of the distance. The second sensor is stationarily disposed in opposed relation to the blade for detecting the mark of the blade to produce a second signal representative of a position of the mark. The computing unit is connected to the first and second sensors for receiving the first signal from the first sensor in synchronization with the second signal from the second sensor, and computing an amount of warp of the blade as to a fixed position thereof by using the received first signal.

REFERENCES:
patent: 3681978 (1972-08-01), Mathias et al.
patent: 3895358 (1975-07-01), Pearl
patent: 3986010 (1976-10-01), Lankford et al.
patent: 4498345 (1985-02-01), Dyer et al.
patent: 4531436 (1985-07-01), Antonissen
patent: 4653361 (1987-03-01), Zobeli
IBM Technical Disclosure Bulletin, vol. 25, No. 5 (Oct. 1982), (2 pages).

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