Apparatus for cutting inner circumferential surface of thick wal

Turning – Lathe – Multiple

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

408 62, 408 69, 408705, B23B 508

Patent

active

053159047

ABSTRACT:
A device for cutting the inner circumferential surface of a thick-walled small diameter pipe comprising a setting means for inserting a core bar having a cutting blade on one end thereof into a pipe to be processed, a rotating means for rotating said pipe to be processed set by the setting means about the axis thereof relative to said core bar, a feed means for cutting the inner surface of said pipe to be processed with said cutting blade while pulling the core bar which is securedly held at the other end thereof relative to said pipe to be processed, and a control means for controlling each of said means, providing a smooth high quality inner surface having excellent proof pressure against internal pressure.

REFERENCES:
patent: 1532107 (1925-03-01), Ferris
patent: 2183861 (1939-12-01), Cotter, Sr.
patent: 2315476 (1943-03-01), Groene
patent: 3046846 (1962-07-01), Bonnafe
patent: 3517536 (1970-06-01), Fitzmaurice
patent: 4531868 (1985-07-01), Gabriele
patent: 4573841 (1986-03-01), Petkov et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for cutting inner circumferential surface of thick wal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cutting inner circumferential surface of thick wal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cutting inner circumferential surface of thick wal will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1620876

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.