Apparatus for cutting and removing dry film photoresist from pri

Cutting – With means to convey work relative to tool station – Cut made parallel to direction of and during work movement

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

83125, 83126, 83152, 83563, B26F 102, B21D 4502

Patent

active

041310420

ABSTRACT:
Apparatus for cutting and removing layers of photoresist overlaying tooling holes in a printed wire board blank. A lower cutter is mounted on a base so that its cutting edge projects above the upper surface of the base a distance substantially equal to the thickness of a layer of photoresist. A cutter head is mounted on the base for movement parallel to the upper surface of the base. An upper cutter is mounted on the cutter head for movement by a cutter actuator to cause the upper and lower cutters to sever segments of layers of photoresist overlaying a tooling hole of a PWB blank positioned between them. Each cutter is provided with a plunger movable within their respective cutters. The upper surface of the lower plunger, when the lower plunger is retracted, projects above the lower cutting edge of the lower cutter; and the upper plunger is biased downwardly so that its bottom surface projects below the cutting edges of the upper cutter. As a result the plungers stress the photoresist layers overlaying a tooling hole prior to the upper and lower cutters engaging them. A plunger actuator then moves the lower plunger toward the upper plunger pressing the severed segments together and against the upper plunger. The upper plunger has a conduit connected to a source of vacuum to cause the two segments, which adhere to one another, to adhere to the upper plunger. The upper cutter is retracted and the cutter head moved to place the upper cutter over a disposal opening in the base. The conduit is then connected to a source of compressed air to discharge the segments into the disposal opening.

REFERENCES:
patent: 415477 (1889-11-01), Stevens
patent: 1493994 (1924-05-01), LeFese
patent: 2251135 (1941-07-01), Iknayan et al.
patent: 3568554 (1971-03-01), Wiechec

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for cutting and removing dry film photoresist from pri does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cutting and removing dry film photoresist from pri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cutting and removing dry film photoresist from pri will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1124209

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.