Apparatus for cutting and forming flexible beam leads of an inte

Details Apparatus for cutting and forming flexible beam leads of an inte Apparatus for cutting and forming flexible beam leads of an inte

1976-10-18

1977-12-27

Larson, Lowell A.

Wireworking

Crimping

72330, 72DIG10, B21F 100

Patent

active

040649172

ABSTRACT:
Apparatus for blanking an integrated circuit (I.C.) chip and the chip's thin flexible ductile leads from a segment of film and forming the leads of the chip in a single operation of a hollow punch having cutting and forming edges and a hollow die having cutting edges with a forming block having forming edges positioned within the die. The punch and die are mounted on a punch press. Alignment pins are provided which at the beginning of each blanking and forming operation engage reference sprocket holes of a film segment to which an I.C. chip is mounted to accurately position the chip and its leads with respect to the punch and die. A pressure pad is mounted in the punch and presses the leads against a portion of the forming block to isolate the bonds between the leads and the integrated circuit chip from forces applied to the leads during cutting and forming. The punch then approaches the die until the cutting edges of the punch and die sever the leads and the forming edges of the punch and forming block bend the leads. The severed I.C. chip and its formed leads are lifted from the forming block by being held against the pressure pad by a vacuum as the punch returns to its initial position.

REFERENCES:
patent: 1070682 (1913-08-01), Graf
patent: 3698618 (1972-10-01), Helda
patent: 3769823 (1973-11-01), Greeninger
patent: 3796201 (1974-03-01), Golub
patent: 3882597 (1975-05-01), Chayka et al.

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