Turning – Severing or cut-off – Combined with means to heat tool and/or work
Patent
1984-10-17
1986-08-05
Bray, W. D.
Turning
Severing or cut-off
Combined with means to heat tool and/or work
51216LP, 83 15, 83171, 83914, 82DIG1, 219 68, B23B 3700
Patent
active
046036091
ABSTRACT:
The invention provides an apparatus for cutting a sheet-like member such as an adhesive tape applied to a surface of a semiconductor wafer at the periphery of said semiconductor wafer.
The apparatus comprises a heating rod to be brought into contact with the periphery of the semiconductor wafer, heating means for heating the heating rod, urging means for relatively urging the heating rod against the periphery of the semiconductor wafer, and a moving mechanism for relatively moving the heating rod along the periphery of the semiconductor wafer. The heating rod is moved relative to the periphery of the semiconductor wafer as the heating rod is urged against the periphery of the semiconductor wafer, and thereby the sheet-like member applied to the semiconductor wafer is melted and cut at the periphery of the semiconductor wafer.
In order to avoid a swell of the melted sheet-like member, a portion of the heating rod which is brought into contact with the periphery of the semiconductor wafer may defining a sharp cutting edge.
REFERENCES:
patent: 4414872 (1983-11-01), Bard et al.
Bray W. D.
Disco Abrasive Systems, Ltd.
LandOfFree
Apparatus for cutting a sheet-like member applied to a surface o does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for cutting a sheet-like member applied to a surface o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cutting a sheet-like member applied to a surface o will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-963653