Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1986-11-14
1988-10-18
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
156 94, 1562722, 1562737, 1562739, 1562757, 1563797, 1563804, 2940209, 29829, 29843, 29850, 29874, 219 1081, 219 561, 219119, B32B 3114
Patent
active
047785560
ABSTRACT:
A method and apparatus are shown for use in adding electrical connections to existing printed circuit boards. To this end, apparatus in the form of a multilayered pad is provided which has an adhesive layer over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet of pads into individual pads, placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads to bond them to the board, and stitching (welding) wire to a succession of pads to complete a series of new connections. Some pads include plated-through-holes enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.
REFERENCES:
patent: 3775579 (1973-11-01), Burghart et al.
patent: 3786172 (1974-01-01), Conley
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3896285 (1975-07-01), Delorme
patent: 4016025 (1977-04-01), Peterson
patent: 4104109 (1978-08-01), Grau et al.
patent: 4230925 (1980-10-01), Lascelles
patent: 4351468 (1982-09-01), Floury et al.
patent: 4465913 (1984-08-01), Stokoe et al.
Jehay Michel
Job Andre
Wery Jean C.
Starr Mark T.
Unisys Corporation
Weston Caleb
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