Apparatus for cooling semiconductor devices attached to a...

Details Apparatus for cooling semiconductor devices attached to a... Apparatus for cooling semiconductor devices attached to a...

2007-03-06

2007-03-06

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S700000, C361S704000, C361S714000, C165S080300, C165S185000, C174S252000

Reexamination Certificate

active

10914624

ABSTRACT:
An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring imparts a force on the semiconductor device to retain the semiconductor device in a thermally conductive position with respect to the cooling plate. A positive cooling effect is achieved regardless of mounting conditions including orientation of the electronic assembly, and the position of the semiconductor device on the cooling plate.

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Integral, Structural, natural convection cooled heatsink. Research Disclosure, pp. 238-240, Feb. 2001.

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