Apparatus for cooling printed circuit boards in wave soldering

Details Apparatus for cooling printed circuit boards in wave soldering Apparatus for cooling printed circuit boards in wave soldering

1995-09-08

1997-11-11

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 42, 228 46, B23K 300

Patent

active

056854757

ABSTRACT:
An apparatus and method for soldering components to a circuit board. The apparatus includes a conveyor in a tunnel for transporting the board through a preheat zone, molten waves of solder including a turbulent wave and a laminar wave, and a cool down zone through which the board passes upon exit from the laminar flow wave of the solder wave. The improvement comprises at least one distributing manifold mounted in the tunnel having an inlet port for receiving a cold gas under pressure and at least one outlet nozzle for directing the cold gas to the circuit board, thereby rapidly cooling the circuit board and the components.

REFERENCES:
patent: 3579853 (1971-05-01), Martino
patent: 3724418 (1973-04-01), McLain
patent: 4361967 (1982-12-01), Bahnsen et al.
patent: 4390120 (1983-06-01), Broyer
patent: 4679720 (1987-07-01), Sedrick, Jr. et al.
patent: 4921156 (1990-05-01), Hohnerlein
patent: 5141147 (1992-08-01), Yokota
patent: 5240169 (1993-08-01), Gileta
patent: 5388752 (1995-02-01), Kawakatsu

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