Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-08-02
1998-05-26
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 802, 165185, 174 163, 257713, 361718, H05K 720
Patent
active
057576203
ABSTRACT:
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.
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Courtney Mark Gerard
Edwards David Linn
Fahey Albert Joseph
Hopper Gregory Scott
Iruvanti Sushumna
Ahsan Aziz M.
International Business Machines - Corporation
Thompson Gregory D.
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