Apparatus for cooling of chips using blind holes with customized

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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165 802, 165185, 174 163, 257713, 361718, H05K 720

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active

057576203

ABSTRACT:
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

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