Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-08-02
1997-04-22
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 802, 165185, 257706, 257713, 361715, 361717, 361722, H05K 720
Patent
active
056233949
ABSTRACT:
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
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Courtney Mark G.
Edwards David L.
Fahey Albert J.
Hopper Gregory S.
Iruvanti Sushumna
Ahsan Aziz M.
International Business Machines - Corporation
Thompson Gregory D.
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