Apparatus for cooling integrated circuit chips with forced coola

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361385, 357 82, H05K 720

Patent

active

047500867

ABSTRACT:
The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible microbellows. The surface area of the heat spreader is greater than the mating surface area of the chip. The heat spreader is attached to the bottom surface of the microbellows. The surface area of the heat spreader which mates with the surface of the chip is highly polished and coated with a highly conductive soft metal. A jet of coolant is forced into the inner surface of the microbellows.

REFERENCES:
patent: 3649738 (1972-03-01), Anderson et al.
patent: 3794886 (1974-02-01), Goldman
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4449580 (1984-05-01), Reisman et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4619316 (1986-10-01), Nakayama et al.
Pascuzzo et al, "Integrated Circuit Module Package Cooling Structure", IBM TDB, vol. 20, No. 10, Mar. 1978.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for cooling integrated circuit chips with forced coola does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cooling integrated circuit chips with forced coola, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling integrated circuit chips with forced coola will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-848174

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.