Apparatus for cooling integrated circuit chips

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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16510433, 361385, H05K 720

Patent

active

044854293

ABSTRACT:
A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bunches of heat conducting strands extend into the first cooling portion so that each bunch is urged into deflecting contact with a respective chip. A fluid inlet and outlet are provided in the second cooling portion.

REFERENCES:
patent: 4156458 (1979-05-01), Chu
patent: 4203129 (1980-05-01), Oktay
IBM Tech. Discl. Bull., vol. 20, No. 10, Mar. 1978, p. 3919, "Device Cooling", Johnson.

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