Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

1983-01-31

1984-12-18

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 16R, H05K 720

Patent

active

044893639

ABSTRACT:
Apparatus is provided for cooling a closely grouped plurality of integrated circuit chips by forced air convection. A heat sink, having a plurality of fins and a narrow channel between each fin, is connected to a first side of a substrate and has one end protruding into an aperture in the substrate. A chip is connected directly to the one end of the sink and is electrically connected to a second side of the substrate.

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Tuckerman et al., "High-Performance Heat Sinking for VLSI", IEEE Electron Device Letters, vol. 2 EDL-2, No. 5, 5/81.
Dumaine et al., "IBM Technical Disclosure Bulletin", vol. 20, No. 4, 9/77, p. 1472.
Archey, "IBM Technical Disclosure Bulletin", vol. 19, No. 2, 7/76, p. 412.
Tiffany, "IBM Technical Disclosure Bulletin", vol. 13, No. 1, 6/70, p. 58.

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