Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

1982-06-09

1984-05-22

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361385, 361399, H05K 720

Patent

active

044505051

ABSTRACT:
A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellows extend into the first cooling portion so that each bellows is urged into deflecting contact with a respective chip. A plurality of heat conducting strands are mounted in each bellows and extend into the second cooling portion. A fluid coolant is directed to flow across the heat conducting strands.

REFERENCES:
patent: 4138692 (1979-02-01), Meeker
patent: 4156458 (1979-05-01), Chu
patent: 4203129 (1980-05-01), Oktay
Buller, "Dendritic Heat Sink", IBM Tech. Discl. Bull., vol. 23, No. 11, Apr. 1981, pp. 4853.
Johnson, "Device Cooling", IBM Tech. Discl. Bull., vol. 20, No. 10, Mar. 1978, pp. 3919.

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