Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

1987-01-02

1987-09-15

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 174 15R, 357 82, 361382, H05K 720

Patent

active

046943781

ABSTRACT:
A boiling type cooling structure for cooling semiconductor chips mounted on printed circuit cards, with a heat conductive stud being attached to the surface of each chip. Cooling plates with fins, arranged so as to surround the circumference of each heat conductive stud, are placed between the printed circuit cards in order to condense the vapor bubbles produced near the heat conductive studs.

REFERENCES:
patent: 3858090 (1974-12-01), Lehmann
patent: 4203129 (1980-05-01), Oktay et al.
Chu et al., "Thermal Card and Deflector System for Augmenting Emersion Cooling", IBM Technical Disclosure Bulletin, vol. 10, No. 10, 3/68, pp. 1559-1560.

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