Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

1982-06-09

1984-08-28

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361385, 361386, 16510433, 357 82, H05K 720

Patent

active

044687176

ABSTRACT:
A multichip thermal conduction module has improved cooling in a housing having at least one board mounted therein including a plurality of chips on the board. A heat conducting plate is mounted in the housing adjacent the chips. A cold plate abuts heat conducting plate and includes an inlet an outlet connected to a coolant passage formed therein for guiding a coolant through the housing. Flexible heat conductors are connected to the heat conducting plate and are urged into aligned contact with the chips for conducting heat therefrom. The flexible conductors are in fluid communication with the cold plate passage for conducting coolant adjacent the chips.

REFERENCES:
patent: 4138692 (1979-02-01), Meeker
patent: 4156458 (1979-05-01), Chu
patent: 4203129 (1980-05-01), Oktay
Lifshey et al., "Heat Sink Using Retractable Bellows", IBM Tech. Discl. Bull., vol. 23, No. 7A, Dec. 1980, p. 2905.

Affiliated with

Also associated with

Rating

Apparatus for cooling integrated circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cooling integrated circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling integrated circuit chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-880530