Apparatus for cooling high-density integrated circuit packages

Details Apparatus for cooling high-density integrated circuit packages Apparatus for cooling high-density integrated circuit packages

1986-09-19

1988-03-15

Davis, Jr., Albert W.

Heat exchange

With retainer for removable article

Electrical component

165185, 165903, 361385, 357 82, H01L 2346

Patent

active

047306653

ABSTRACT:
An apparatus for containing and cooling high-density integrated circuit packages includes a housing in which the circuit package is sealingly mounted in an internal chamber of said housing. The chamber is at least partially filled with a plurality of thermally conductive spheroids which are biased into thermally conductive contact with each other and with the integrated circuit package to maximize the heat exchange surface. The apparatus includes an inlet and an outlet for passing a dielectric immersion coolant through the chamber in direct heat exchange relationship with the spheroids and with the high-density integrated circuit package.

REFERENCES:
patent: 3171731 (1965-03-01), Barger et al.
patent: 3274429 (1966-09-01), Swiadek
patent: 3995181 (1976-11-01), Suit
McGregor, J. E., Component Support and Cooling, IBM Technical Disclosure Bulletin, vol. 2, No. 5, 2/1960.

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