Apparatus for cooling high-density integrated circuit packages

Details Apparatus for cooling high-density integrated circuit packages Apparatus for cooling high-density integrated circuit packages

1981-04-23

1983-04-26

Richter, Sheldon J.

Heat exchange

Flexible envelope or cover type

165 80C, 165185, 361385, F24D 1902

Patent

active

043810322

ABSTRACT:
An apparatus for cooling a high-density integrated circuit package including a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the heat generated by operation thereof by means of a fluid coolant which is passed through the heat exchanger. The heat exchanger includes a housing having a coolant chamber one surface of which is formed of a pliable thin-wall metallic diaphragm which is biased into heat conductive contact with the circuit package by biasing structures provided in the coolant chamber of the heat exchanger housing.

REFERENCES:
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4226281 (1980-10-01), Chu
patent: 4235283 (1980-11-01), Gupta

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