Apparatus for cooling high-density integrated circuit packages

Details Apparatus for cooling high-density integrated circuit packages Apparatus for cooling high-density integrated circuit packages

1985-04-08

1986-09-23

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

622591, 165 46, 357 82, 361385, H01L 2346

Patent

active

046129782

ABSTRACT:
An apparatus for cooling a high-density integrated circuit package includes a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the operational heat thereof by means of a coolant which is passed through the heat exchanger. The heat exchanger includes a housing having a coolant chamber with an especially configured thermally conductive wall for engaging the integrated circuit package. The coolant chamber is filled with a plurality of thermally conductive spheroids which are biased into thermally conductive contact with each other and with the special wall to maximize the heat exchange surface in the coolant chamber. The apparatus is preferably employed in combination with a refrigeration system wherein the coolant chamber is the evaporation element of the system for maximum cooling of the integrated circuit package.

REFERENCES:
patent: 3274429 (1966-09-01), Swiadek
patent: 3732919 (1973-05-01), Wilson
patent: 3995181 (1976-11-01), Suit
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4155402 (1979-05-01), Just
patent: 4263965 (1981-04-01), Mansuria et al.
patent: 4531146 (1985-07-01), Cutchaw
McGregor, J. E., Component Support and Cooling, IBM Technical Disclosure, vol. 2, No. 5, 2/1960.

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