Apparatus for cooling high-density integrated circuit packages

Details Apparatus for cooling high-density integrated circuit packages Apparatus for cooling high-density integrated circuit packages

1983-07-14

1985-07-23

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 81, 361385, H01L 2346

Patent

active

045311463

ABSTRACT:
An apparatus for cooling a high-density integrated circuit package including a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the heat generated by operation thereof by means of a fluid coolant which is passed through the heat exchanger. The heat exchanger includes a housing having a coolant chamber one surface of which is formed of a pliable thinwall diaphragm of thermally conductive material. The coolant chamber is filled with a plurality of thermally conductive spheriods which are biased into thermally conductive contact with each other and with the diaphragm by a resilient elastomeric pressure pad which is mounted in the coolant chamber. The biasing force exerted by the spheroids on the diaphragm biases it into thermally conductive contact with the circuit package so that heat is conducted away from the circuit package by the diaphragm and the spheroids.

REFERENCES:
patent: 3648121 (1972-03-01), Suenaga et al.
patent: 4109707 (1978-08-01), Wilson et al.
McGregor, J. E., Component Support and Cooling, IBM Tech. Disc. Bull., vol. 2, No. 5, p. 18, 2/1960.
Ronkese, B. J., Metal Wool and Indium Heat Sink, IBM Tech. Disc. Bull., vol. 21, No. 3, p. 1143, 8/1978.

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