Apparatus for cooling electronic devices using a flexible coolan

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

16510433, 361719, H05K 720

Patent

active

059204575

ABSTRACT:
An apparatus for cooling an electronic assembly. The electronic assembly is placed in thermal contact with a single, continuous and monolithic coolant conduit capable of housing a coolant. A plurality of removable cold plates are coupled to the conduit, through their indentation like openings along a peripheral edge of each plate. The conduit with plates is then bent as to complement the contour of the assembly to be cooled in a three dimensional manner as required.

REFERENCES:
patent: 4029141 (1977-06-01), Ferrari
patent: 4558395 (1985-12-01), Yamada
patent: 4910642 (1990-04-01), Downing
patent: 5150274 (1992-09-01), Okada
patent: 5195020 (1993-03-01), Suzuki
patent: 5413167 (1995-05-01), Hara

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