Apparatus for cooling electronic devices

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

622592, 165 804, 16510433, 174 152, 361788, H05K 720

Patent

active

053433580

ABSTRACT:
An arrangement for cooling electronic components in a system. Several circuit boards are connected to a backplane electrically and through heat pipes, which are mounted on the boards and provide connections between the electronic components on the board and the cooling system. The circuit boards, including the attached heat pipes, can be removed from the backplane by detaching electrical connections on the boards from corresponding connectors on the backplane, while at the same time detaching the ends of the heat pipes from sockets in an expander which forms part of the cooling system. If desired, backplanes can be positioned on both sides of the expander, with sockets provided on both sides of the expander to receive end portions of heat pipes.

REFERENCES:
patent: 3334684 (1964-07-01), Roush et al.
patent: 4155402 (1979-05-01), Just
patent: 4183400 (1980-01-01), Seifert
patent: 4365666 (1982-12-01), Seifert
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4493010 (1985-01-01), Morrison et al.
patent: 4712158 (1987-12-01), Kikuchi et al.
patent: 4733331 (1988-03-01), Chauvet
patent: 4777561 (1988-10-01), Murphy et al.
patent: 4793405 (1988-12-01), Diggelmann et al.
patent: 4873613 (1989-10-01), Iversen
patent: 4907644 (1990-03-01), Ghiraldi
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5057968 (1991-10-01), Morrison
patent: 5095404 (1992-03-01), Chao
patent: 5150274 (1992-09-01), Okada et al.
patent: 5162974 (1992-11-01), Currie
patent: 5177666 (1993-01-01), Bland et al.
patent: 5179500 (1993-01-01), Koubek et al.
patent: 5229915 (1993-07-01), Ishibashi

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for cooling electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cooling electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling electronic devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-33829

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.