Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-11-19
1994-08-30
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 257724, 361784, H05K 720
Patent
active
053433599
ABSTRACT:
The present invention discloses a method and apparatus for conductively transferring heat away from electrical devices located on daughter boards attached to mother boards. The preferred method involves the steps of conductively transferring heat from each electrical device to a conductive layer located within the daughter board, transferring heat from the conductive layer within the daughter board to a conductive structure located on the surface of the daughter board, and transferring heat from the conductive structure to a cooling surface located on the cold plate. The preferred apparatus includes a mother board, a cold plate adjacent the mother board and attached to the mother board, a daughter board with an electrical device attached thereto, the daughter board attached to the mother board opposite the cold plate. The daughter board lies in a plane which is adjacent and substantially parallel to the plane of the mother board. Also included is conductive heat transfer means for conductively transferring heat energy from the electrical device on the daughter board to the cold plate.
REFERENCES:
patent: 2948518 (1960-08-01), Kraus
patent: 3065384 (1962-11-01), Sprude
patent: 3070729 (1962-12-01), Heidler
patent: 3139559 (1964-06-01), Heidler
patent: 3141999 (1964-07-01), Schneider
patent: 3198991 (1965-08-01), Barnett
patent: 3268772 (1966-08-01), Kamei et al.
patent: 3270250 (1966-08-01), Davis
patent: 3327776 (1967-06-01), Butt
patent: 3334684 (1967-08-01), Roush et al.
patent: 3504268 (1970-03-01), Hoffman et al.
patent: 3512582 (1970-05-01), Chu et al.
patent: 3527989 (1970-09-01), Cuzner et al.
patent: 3586959 (1971-06-01), Eccles et al.
patent: 3630273 (1971-12-01), LaHaye et al.
patent: 3631325 (1971-12-01), Wenz
patent: 3648113 (1972-03-01), Rathjen et al.
patent: 3774078 (1973-11-01), Martin
patent: 3812402 (1974-05-01), Garth
patent: 3865183 (1975-02-01), Roush
patent: 3904934 (1975-09-01), Martin
patent: 4120021 (1978-10-01), Roush
patent: 4204247 (1980-05-01), Wigley
patent: 4283754 (1981-08-01), Parks
patent: 4383270 (1983-05-01), Schelhorn
patent: 4535385 (1985-08-01), August et al.
patent: 4551787 (1985-11-01), Mittal et al.
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 4628407 (1986-12-01), August et al.
patent: 4729061 (1988-03-01), Brown
patent: 4884168 (1989-11-01), August et al.
patent: 4939624 (1990-07-01), August et al.
patent: 5014904 (1991-05-01), Morton
patent: 5130768 (1992-07-01), Wu
G. O. Tiffany, "Integrated Circuit Package and Heat Sink", IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, p. 58.
M. J. Donegan, "Thermal Connection for Circuit Package", IBM Technical Disclosure Bulletin, vol. 13, No. 7, Dec. 1970, p. 2029.
C. S. K. Ng, "Circuit Module Package", IBM Technical Disclosure Bulletin, vol. 21, No. 9, Feb. 1979, p. 3591.
A. P. Mandel et al. "Heat Dissipator Assemblies", IBM Technical Disclosure Bulletin, vol. 8, No. 10, Mar. 1966, pp. 1460, 1461.
Bowen Stephen A.
Morton David M.
Cray Research Inc.
Tolin Gerald P.
LandOfFree
Apparatus for cooling daughter boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for cooling daughter boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling daughter boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-33836