Apparatus for cooling components in spacecraft

Heat exchange – With vehicle feature

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S086000, C165S104260, C165S104270, C165S104330, C165S185000, C062S239000, C062S259200, C144S171000

Reexamination Certificate

active

07841382

ABSTRACT:
The invention relates to an apparatus for cooling components in spacecraft, comprising a heat radiator (5) and a heat conductor (3; 3a,3b). A versatile applicability is achieved in such a way that the heat conductor (3, 3a,3b) penetrates an outside wall (1) of the spacecraft and is provided in the interior of the spacecraft with several coupling places (8) for components to be cooled (20) and/or for other heat conductors (10).

REFERENCES:
patent: 3489203 (1970-01-01), Fischell
patent: 3666566 (1972-05-01), Paine
patent: 4324375 (1982-04-01), O'Neill
patent: 4411516 (1983-10-01), Adachi et al.
patent: 4846264 (1989-07-01), Hata
patent: 5117901 (1992-06-01), Cullimore
patent: 5494241 (1996-02-01), Poulain
patent: 5588300 (1996-12-01), Larsson et al.
patent: 5699982 (1997-12-01), Daugherty
patent: 6276144 (2001-08-01), Marland et al.
patent: 4344025 (1995-06-01), None
patent: 0780301 (1997-06-01), None
patent: 0870677 (1998-10-01), None
J.R. Samson et al., “Thermal Management for High Performance Computing in Spaceborne Applications” in 2000 Inter Society Conf. on Thermal Phenomena, May 23, 2000, pp. 247-254.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for cooling components in spacecraft does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for cooling components in spacecraft, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling components in spacecraft will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4199198

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.