Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-10-21
2001-04-17
Picard, Leo P. (Department: 2935)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S689000, C361S695000, C257S717000, C165S121000
Reexamination Certificate
active
06219242
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to cooling systems. More particularly, the invention concerns an apparatus for cooling a heat producing member such as a computer chip or the like.
2. Discussion of the Prior Art
During operation integrated circuit devices, such as computers generate significant amounts of heat. In order to maintain optimal performance this heat must be continuously removed. If the heat is not continuously and efficiently removed, the device may over heat resulting in reduction of operating performance and possible catastrophic damage. In order to avoid over heating, thermal management devices must be used. Prior art thermal management devices typically comprise heat sinks, thermal interface materials, fans, chassis ventilation, and combinations thereof.
As computer technology advances toward faster speeds and higher performance, thermal management becomes increasingly important. Maintaining the proper thermal environment in the computer system is key to reliable, long-term system operation. Typically, thermal management devices such as heat sinks induce improved heat dissipation through the heat dissipating surface areas coupled with strategically directed air flow from a fan disposed proximate the heat dissipating surface area.
The conventional prior art heat sink is formed of a material such as aluminum that readily conducts heat. The heat sink is usually placed on top of and in contact with the integrated circuit device. Through this contact, heat generated by the integrated circuit is conducted into the heat sink and away from the integrated circuit. Typically the heat sink includes a plurality of cooling fins which function to increase the surface area of the heat sink and thus maximize the transfer of heat from the heat sink device into the surrounding air. In this manner the heat sink draws heat away from the integrated circuit and transfers the heat into the surrounding air. A heat sink and fan combination can deliver better thermal performance than a heat sink alone. Accordingly, in order to enhance the cooling capacity of the heat sink, an electrically powered fan is often mounted on the top of the heat sink. Exemplary of this type of heat sink device is that disclosed in U.S. Pat. No. 5, 794,685 issued to Dean. Another prior art patent that discloses the use of a fan to carry heat away from the central processing unit is U.S. Pat. No. 5,740,014 issued to Lin. Still another heat sink device having radial heat and air flow paths is disclosed in U.S. Pat. No. 5,794, 685 issued to Dean.
The present invention is directed to a novel heat sink device that provides a uniquely configured heat dissipating member that functions to efficiently transfer into the surrounding air heat generated by the integrated circuit device. Cooperating with the heat dissipating member is a novel multi-bladed fan assembly that is so constructed and arranged as to draw air past the heat dissipating member and into the interior of the specially configured blades of the fan assembly of the apparatus.
As will be better appreciated from the discussion that follows, the novel cooling apparatus of the present invention cools the heat producing member in several ways. First, the heat from the heat producing member, such as the computer chip, is radiated from the multiplicity of fins of the heat dissipating member outwardly toward a generally truncated, conically-shaped, apertured shroud that surrounds the heat dissipating member. Second, intake air is drawn through the multiplicity of apertures formed in the shroud by a novel rotary fan blade assembly. Air drawn through the shroud flows past the novel heat dissipating member to cool the member by convection and is then directed into the hollow hub of the rotary fan assembly. Connected to the hollow hub are sixteen uniquely configured hollow fan blades, each of which has an apertured trailing edge. The heated gases emerging from the small apertures provided in the trailing edge of each blade create a jet thrust action to the rotating assembly and expand rapidly to produce an additional cooling effect. The heated air radiated from the heat dissipating member is further cooled as it is drawn past the shroud by the fan blades and then around and about the exterior of each of the hollow blades. The heated air passes completely around the exterior, surface of each and every blade from the root of the blade to the extreme tip. This produces a temperature drop not only within the hollow blade, but around the blade and the hub assembly as well.
SUMMARY OF THE INVENTION
By away of summary, a primary object of the present invention is to provide a heat extraction and cooling system which can be readily attached to a heat producing system such as the central processing unit (CPU) of a computer for exchanging heat through an enclosure which houses a ducted fan. The apparatus of the invention is compact and can be quite easily mounted directly onto the CPU. In the preferred form of the invention the apparatus includes a dual section rotary blade system that is driven by a conventional direct current motor. The apparatus also includes a heat conducting base that is placed in thermal engagement with the CPU. Attached to the base is a uniquely configured heat dissipating member which includes a plurality of upstanding heat dissipating fins. A generally conically shaped shroud surrounds the heat dissipating member and is provided with a plurality of apertures for drawing a flow of cooling air through the shroud and past the fins of the heat dissipating member. The duel section rotary blade system pulls air inwardly through the apertured shroud, past the heat dissipating fins and into the hub portion of the rotary blade system. The heated air is then forced into the interior of the uniquely configured, hollow hub blades which are attached to the hub portion. Each of the blades is provided with a leading edge portion and a trailing edge portion having a plurality of small apertures formed therein. As the blades rotate, a negative pressure is formed proximate the trailing edge of each blade and the heated gases are expelled through the small apertures. This provides a jet thrust action to the rotating assembly and causes the heated gases expelled from the hollow blades to expand rapidly thereby producing an additional cooling effect.
It is an object of the present invention to provide a highly efficient thermal management system for effectively cooling a heat producing member such as a computer CPU.
More particularly, it is an object of the invention to provide a thermal management system of the character described which cools the heat producing of member by a number of heat dissipating mechanisms, including radiation, convection and expansion of heated gases.
Another object of the invention is to provide a system for cooling a CPU which provides a highly efficient heat extraction system to effectively carry away unwanted heat from the CPU.
Another object of the invention is to provide a system of the character described in the preceding paragraphs which improves the control of unwanted heat from the aluminum heat sink of the apparatus that is in thermal engagement with the CPU.
Another object of the invention is to provide an apparatus which will substantially reduce the temperature of the CPU and efficiently establish and maintain temperatures well below acceptable levels, thereby permitting the CPU to operate at higher clock speeds.
Another object of the invention is to provide a system of the character described in the preceding paragraphs which allows the CPU manufacturers to design and build chip architecture to operate at substantially higher clock speeds.
REFERENCES:
patent: 1884094 (1932-10-01), Modine
patent: 4327398 (1982-04-01), Christison
patent: 5132780 (1992-07-01), Higgins
patent: 5297005 (1994-03-01), Gourdine
patent: 5419679 (1995-05-01), Gaunt et al.
patent: 0860874A2 (1997-02-01), None
Brunton James E.
Datskovsky Michael
Picard Leo P.
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