Apparatus for controlling plating over a face of a substrate

Details Apparatus for controlling plating over a face of a substrate Apparatus for controlling plating over a face of a substrate

1998-05-21

2000-03-28

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

205224, 204224R, 204241, 204275, 4274301, 4274343, 118 59, 118666, C25D 534, C25D 550, C25D 1700, B05D 118, B05C 1100

Patent

active

060427124

ABSTRACT:
According to one aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a substrate holder, and a temperature control device. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank. The temperature control device provides selective control of temperature in various regions of the substrate during plating so as to control plating over the first face of the substrate.

REFERENCES:
patent: 4217183 (1980-08-01), Melcher et al.
patent: 5127362 (1992-07-01), Iwatsu et al.
patent: 5580607 (1996-12-01), Takekuma et al.
patent: 5814365 (1998-09-01), Mahawili

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