Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate
2007-06-12
2007-06-12
Noguerola, Alex (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
C205S794000, C204S434000
Reexamination Certificate
active
10372955
ABSTRACT:
A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition. The electroanalytical measurement is then used to determine an amount of the target constituent in the electroplating solution. An automatic dosing system that includes the foregoing method and/or one or more known electroanalytical techniques in a close-loop system is also set forth.
REFERENCES:
patent: 3649509 (1972-03-01), Morawetz et al.
patent: 3878066 (1975-04-01), Dettke et al.
patent: 3904493 (1975-09-01), Losi et al.
patent: 4051001 (1977-09-01), Inoue et al.
patent: 4055751 (1977-10-01), Bussman et al.
patent: 4090926 (1978-05-01), Matson
patent: 4132605 (1979-01-01), Tench et al.
patent: 4146437 (1979-03-01), O'Keefe
patent: 4229218 (1980-10-01), Gulla et al.
patent: 4290856 (1981-09-01), Inoue
patent: 4324589 (1982-04-01), Gulla et al.
patent: 4326940 (1982-04-01), Eckles et al.
patent: 4468305 (1984-08-01), Hillis
patent: 4469564 (1984-09-01), Okinaka et al.
patent: 4479852 (1984-10-01), Bindra et al.
patent: 4511443 (1985-04-01), Goffman et al.
patent: 4541902 (1985-09-01), Kinoshita et al.
patent: 4699081 (1987-10-01), Mack
patent: 4834842 (1989-05-01), Langner et al.
patent: 4886590 (1989-12-01), Tittle
patent: 4895739 (1990-01-01), Bladon
patent: 4917774 (1990-04-01), Fisher
patent: 4917777 (1990-04-01), Fisher
patent: 4948473 (1990-08-01), Phillippi
patent: 4952286 (1990-08-01), Bladon et al.
patent: 5007990 (1991-04-01), Bladon
patent: 5192403 (1993-03-01), Chang et al.
patent: 5196096 (1993-03-01), Chang et al.
patent: 5223118 (1993-06-01), Sonnenberg et al.
patent: 5234573 (1993-08-01), Takami
patent: 5364510 (1994-11-01), Carpio
patent: 5368715 (1994-11-01), Hurley et al.
patent: 5389215 (1995-02-01), Horiuchi et al.
patent: 5391271 (1995-02-01), Ludwig
patent: 5450870 (1995-09-01), Suga et al.
patent: 5484626 (1996-01-01), Storjohann et al.
patent: 5534128 (1996-07-01), Aso et al.
patent: 5709839 (1998-01-01), Dobson
patent: 5935402 (1999-08-01), Fanti
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6024856 (2000-02-01), Haydu et al.
patent: 6113769 (2000-09-01), Uzoh et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6254760 (2001-07-01), Shen et al.
patent: 6280602 (2001-08-01), Robertson
patent: 6365033 (2002-04-01), Graham et al.
patent: 6458262 (2002-10-01), Reid
patent: 6471845 (2002-10-01), Dukovic et al.
patent: 10-060693 (1998-03-01), None
patent: 10-60693 (1998-03-01), None
CAPLUS abstract of Vyakhirev ('Polarographic control of electrolyte baths. III, Zavodskaya Laboratoriya (1947), 13, 1167-71)
CAPUS abstract of Korshunov et al. (“Polarographic analysis of zinc-plating baths,” Zavodskaya Laboratoriya (1947), 13, 1172-3).
“Polarographic and Ancillary Instrumentation—303A Static Mercury Drop Electrode” product description from Princeton Applied Research downloaded Mar. 4, 2006 from www.princetonappliedresearch.com.
Derwent abstract of JP 10-60693 A.
JPO computer translation of Mitsuaki et al. (JP 10-060693 A).
Z. Sun et al.,Optimized Bath Control for Void-Free Copper Deposition, Solid State Technology, pp. 1-10, Nov. 2001.
Dennis Tench and John White,Cyclic Pulse Voltammetric Stripping Analysis of Acid Copper Plating Baths, Journal of the Electromechanical Society, vol. 132, No. 4, pp. 831-834, Apr. 1985.
Hobart H. Willard, et al.,Instrumental Methods of Analysis, Fifth Edition, D. Van Nostrand Company, New York, N.Y., pp. 647-656, 1974.
Frederick A. Lowenheim,Electroplating, McGraw-Hill Book Company, pp. 120 & 121, 1979.
Carpenter Bradley C.
Graham Lyndon W.
Lindberg Fredrick A.
Ritzdorf Thomas L.
Taylor Thomas C.
Edell Shapiro & Finnan LLC
Noguerola Alex
Semitool Inc.
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