Apparatus for controlled fracture substrate singulation

Details Apparatus for controlled fracture substrate singulation Apparatus for controlled fracture substrate singulation

2007-02-06

2007-02-06

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S462000, C438S464000, C219S067000, C219S121140, C156S345420, C156S583200

Reexamination Certificate

active

11291255

ABSTRACT:
An apparatus and a system for separating dice from a substrate are described herein.

REFERENCES:
patent: 6429506 (2002-08-01), Fujii et al.
patent: 6596562 (2003-07-01), Maiz

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