Apparatus for contouring edge of semiconductor wafers

Details Apparatus for contouring edge of semiconductor wafers Apparatus for contouring edge of semiconductor wafers

1976-03-29

1977-06-28

Smith, Al Lawrence

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51106R, B24B 900

Patent

active

040316670

ABSTRACT:
Apparatus is provided for beveling or rounding the edge of thin, disc-like workpieces, such as silicon wafers integrated circuit masks and the like and includes a rotatable holder for receiving and releasably holding such a workpiece and rotating the workpiece with its edge free of obstruction. A rotating grinding wheel axially parallel to the workpiece and holder and having a V-shaped circumferential groove is urged against the edge of the workpiece by resilient biasing means so that the grinding wheel will be maintained in grinding engagement with the workpiece edge during the rotation of the workpiece.

REFERENCES:
patent: 1145194 (1915-07-01), Hansen
patent: 2826872 (1958-03-01), Robbins
patent: 3274736 (1966-09-01), Brokaw
patent: 3332172 (1967-07-01), Stern
patent: 3921788 (1975-11-01), Roberson
patent: 3953941 (1976-05-01), Kuhn

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