Electric heating – Metal heating – For bonding with pressure
Patent
1986-07-18
1988-01-19
Goldberg, E. A.
Electric heating
Metal heating
For bonding with pressure
219 85R, 219121LC, 219 8SF, B23K 104
Patent
active
047206179
ABSTRACT:
An apparatus for the continuous processing of a work piece, such as an IC-chip or an LSI-chip, in the directions of the x- and y-coordinates, which comprises a pair of heat ray sources arranged on a heat ray source assembly for irradiating a corresponding pair of parallel processing lines extending in the direction of the x-coordinate, by focussing heat rays onto each of the processing lines in the shape of a straight line. A cylinder/piston arrangement effects vertical positioning of the pair of heat ray sources for adjusting the focussing of heat rays onto the processing line. A turning mechanism turns the heat ray source assembly through 90.degree. so as to align the pair of line foci with a pair of parallel processing lines extending in the direction of the y-coordinate. There is a distance adjustment for adjusting the distance between the pair of parallel line foci by effecting a parallel relative shifting of the pair of heat ray sources. A masking element for each heat ray source has a pair of shield members for limiting the width of the heat ray beam discharged from the heat ray source, to determine the length of the line focus for each operation in the x- or y-direction. A masking element actuator is provided for each pair of heat ray sources and comprises a pair of cylinder/piston units for effecting simultaneous relative shifting of the pair of shield members to limit the width of the heat ray beam and thus to define the length of the line focus.
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Hayakawa Futomi
Onoda Kazuo
Goldberg E. A.
Hy-Bec Corporation
Sigda C. M.
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