Apparatus for contactless real-time in-situ monitoring of a chem

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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G01N 2700

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active

055736238

ABSTRACT:
A contactless method and apparatus for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant are disclosed. The method comprises steps of providing at least two toroidal windings in the wet chemical etchant to be proximate to but not in contact with the workpiece; and monitoring an electrical characteristic between said at least two toroidal windings, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process. Such a method and apparatus are particularly useful in a wet chemical etch station.

REFERENCES:
patent: 2933675 (1960-04-01), Hoelzle
patent: 3163568 (1964-12-01), LeMieux
patent: 3292077 (1966-12-01), Sloughter
patent: 3553052 (1972-01-01), Jubb, Jr.
patent: 3806798 (1974-04-01), Gross
patent: 3874959 (1975-04-01), Hoekstra et al.
patent: 3959046 (1976-05-01), Bussmann et al.
patent: 3964956 (1976-06-01), Snyder
patent: 4207137 (1980-06-01), Tretola
patent: 4338157 (1982-07-01), Kanda
patent: 4497699 (1985-02-01), deWit et al.
patent: 4621037 (1986-11-01), Kanda et al.
patent: 4755442 (1988-07-01), Hasebe et al.
patent: 4767496 (1988-08-01), Hieber
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4954212 (1990-09-01), Gabriel et al.
patent: 4969973 (1990-11-01), Rinck et al.
patent: 4995939 (1991-02-01), Ferenczi et al.
patent: 5071508 (1991-12-01), Scheithauer et al.
patent: 5081421 (1992-01-01), Miller et al.
patent: 5198072 (1993-03-01), Gabriel
patent: 5338390 (1994-08-01), Barbee et al.
Goubau, W. M., "Capacitive Etch Rate Monitor for Dielecric Etching", IBM Technical Disclosure Bulletin vol. 31, No. 1, Jun. 1988, pp. 448-449.
Liu et al., "Resistance/Capacitance Methods for Determining Oxide Etch End Point", IBM Technical Disclosure Bulletin vol. 16, No. 8, Jan. 1974, pp. 2706-2707.
Hoekstra, J. P., "Establishing End Point During Delineation Process", IBM Technical Disclosure Bulletin vol. 16, No. 6, Nov. 1973, pp. 1717-1720.
Bassous et al., "An In-Situ Etch Rate Monitor Controller", IBM Technical Disclosure Bulletin vol. 20, No. 3, Aug. 1977, pp. 1232-1234.

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