Apparatus for connecting semiconductor devices to wiring boards

Metal working – Barrier layer or semiconductor device making

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29740, 29834, 29842, 2281802, 228 62, B23K 3100, H01L 2192

Patent

active

051155451

ABSTRACT:
An apparatus for connecting a semiconductor device having multi-electrodes at small pitches to a wiring board in such a manner as to secure the alignment between the electrodes and the wiring patterns, the chips being secured to the wiring board with an insulating resin of a photo-setting nature. The apparatus eliminates the necessity of using heat or supersonic waves, thereby reducing equipment costs.

REFERENCES:
patent: 2756483 (1956-07-01), Wood
patent: 3204327 (1965-09-01), Costa
patent: 3657790 (1972-04-01), Larrison
patent: 3729966 (1973-05-01), Khoury et al.
patent: 3811182 (1974-05-01), Ryan, Sr. et al.
patent: 3946484 (1976-03-01), Aronstein et al.
patent: 4095095 (1978-06-01), Muraoka et al.
patent: 4340617 (1952-07-01), Deutsch et al.
patent: 4718967 (1988-01-01), Irie
patent: 4749120 (1988-06-01), Hatada
H. Fujimoto et al; "A New Assembly Technology for LED Array Using Micro Bump Bonding Method", Shingaku Gihou, vol. 88, pp. 49-53, Oct. 21, 1988.

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