Apparatus for connecting semiconductor devices to wiring boards

Details Apparatus for connecting semiconductor devices to wiring boards Apparatus for connecting semiconductor devices to wiring boards

1990-03-20

1992-05-26

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

29740, 29834, 29842, 2281802, 228 62, B23K 3100, H01L 2192

Patent

active

051155451

ABSTRACT:
An apparatus for connecting a semiconductor device having multi-electrodes at small pitches to a wiring board in such a manner as to secure the alignment between the electrodes and the wiring patterns, the chips being secured to the wiring board with an insulating resin of a photo-setting nature. The apparatus eliminates the necessity of using heat or supersonic waves, thereby reducing equipment costs.

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H. Fujimoto et al; "A New Assembly Technology for LED Array Using Micro Bump Bonding Method", Shingaku Gihou, vol. 88, pp. 49-53, Oct. 21, 1988.

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