Metal working – Barrier layer or semiconductor device making
Patent
1990-03-20
1992-05-26
Chaudhuri, Olik
Metal working
Barrier layer or semiconductor device making
29740, 29834, 29842, 2281802, 228 62, B23K 3100, H01L 2192
Patent
active
051155451
ABSTRACT:
An apparatus for connecting a semiconductor device having multi-electrodes at small pitches to a wiring board in such a manner as to secure the alignment between the electrodes and the wiring patterns, the chips being secured to the wiring board with an insulating resin of a photo-setting nature. The apparatus eliminates the necessity of using heat or supersonic waves, thereby reducing equipment costs.
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H. Fujimoto et al; "A New Assembly Technology for LED Array Using Micro Bump Bonding Method", Shingaku Gihou, vol. 88, pp. 49-53, Oct. 21, 1988.
Fujimoto Hiroaki
Hatada Kenzo
Otani Kazuya
Takeda Kimiaki
Takeshita Yoshinobu
Chaudhuri Olik
Griffis Andrew
Matsushita Electric - Industrial Co., Ltd.
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