Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2011-01-04
2011-01-04
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23010, C257S784000, C257S786000, C257S734000, C257S738000, C257S778000, C257S712000, C257S713000, C257S717000, C257S720000, C257S675000
Reexamination Certificate
active
07863738
ABSTRACT:
In a method and system for transferring at least one of power and ground signal between a die and a package base of a semiconductor device, a connector is formed there between. The connector, which is disposed above the die attached to the package base, includes a center pad electrically coupled to the die by a plurality of conductive bumps and a finger extending outward from the center pad towards the package base. The finger is electrically coupled to the package base by a conductive pad. A plurality of bond wires are formed to electrically couple the package base and the die. A resistance of a conductive path via the connector is much less than a resistance of a conductive path via any one of the plurality of bond wires to facilitate an efficient transfer of the at least one of power and ground signal.
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Brady III Wade J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
Williams Alexander O
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