Apparatus for conditioning wafers

Foods and beverages: apparatus – Subjecting food to an enclosed modified atmosphere – Including means to influence movement of gas within enclosure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

99485, 426524, A23B 404

Patent

active

045246823

ABSTRACT:
Apparatus for conditioning wafers, such as wafer sheets, flat wafers, low hollow wafers and the like comprises an insulated conditioning chamber, which is closed except for a feed opening and a discharge opening, a revolving conveyor, which extends in the conditioning chamber adjacent to the feed opening and the discharge opening and is provided with successive compartments for receiving wafers, and air-guiding passages, which extend along the path of the compartments and are connected to an air-conditioning plant, which is preferably disposed outside the conditioning chamber. The clearance between the supporting elements which have been moved or swung toward each other is substantially one to 5 times, preferably 1.1 to two times, the wall thickness of a flat wafer or once to twice the height of a low hollow wafer. At least one of the two supporting elements rises above the received wafer at least with a projecting portion.

REFERENCES:
patent: 2750875 (1956-06-01), Finlayson
patent: 3855912 (1974-12-01), Schoonmaker
patent: 3961569 (1976-06-01), Kenyon
patent: 3972279 (1976-08-01), Powers
patent: 4029004 (1977-06-01), Isenberg
patent: 4417508 (1983-11-01), Haas

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for conditioning wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for conditioning wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for conditioning wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-549287

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.