Apparatus for conditioning a substrate

Details Apparatus for conditioning a substrate Apparatus for conditioning a substrate

2007-02-23

2010-06-08

Nguyen, Anthony H. (Department: 2854)

Electrophotography

Document handling

Copy

C399S388000

Reexamination Certificate

active

07734244

ABSTRACT:
An image development method implemented on a substrate conditioning unit for the drying and compression of a print substrate in an electrophotographic imaging process. The conditioning unit includes a heating mechanism for maintaining the heat of compression rollers, belts or nip rollers for compressing the substrate by a determined distance between the conditioning rollers, or by direct contact between a compression roller and a nip roller, and having an abhesive layer to prevent adhesion of the conditioning unit to the print substrate.

REFERENCES:
patent: 3121006 (1964-02-01), Middleton et al.
patent: 4286033 (1981-08-01), Neyhart et al.
patent: 4291110 (1981-09-01), Lee
patent: 4338387 (1982-07-01), Hewitt
patent: 4440486 (1984-04-01), Isaka et al.
patent: 4464450 (1984-08-01), Teuscher
patent: 4587189 (1986-05-01), Hor et al.
patent: 4664995 (1987-05-01), Horgan et al.
patent: 4921773 (1990-05-01), Melnyk et al.
patent: 5136334 (1992-08-01), Camis et al.
patent: 5412459 (1995-05-01), Borsuk et al.
patent: 5621512 (1997-04-01), Uehara et al.
patent: 5689785 (1997-11-01), Kato et al.
patent: 5887236 (1999-03-01), Hirao et al.
patent: 6226488 (2001-05-01), Maeyama
patent: 7283760 (2007-10-01), Condello et al.
patent: 7383011 (2008-06-01), Omata
patent: 2004/0175208 (2004-09-01), Ichida et al.

Affiliated with

Also associated with

Rating

Apparatus for conditioning a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for conditioning a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for conditioning a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4212283