Apparatus for concurrently sputtering different materials

Details Apparatus for concurrently sputtering different materials Apparatus for concurrently sputtering different materials

1974-02-01

1976-10-12

Vertiz, Oscar R.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192, C23C 1500

Patent

active

039856356

ABSTRACT:
Separator shields are provided between the substrates subject to sputtering and the boundaries between cathodes or between portions of the cathodes exposing different materials to be sputtered by a glow discharge. The shields extend to a few millimeters' spacing from the cathode and are at a potential at or near ground potential within .+-. 50 volts of the potential of the substrates. A common rear and side shield and a common electrical feed-through connection is provided for the cathode structure or cathodes. The substrates may be passed repeatedly through the sputtering zone or, in a circular configuration, can be moved in a circular path, so as to facilitate alloy-type coatings by producing very thin layers in alternation. The shielding reduces masking of one material by another on the cathode by cross-sputtering, thereby maintaining close to constancy the sputtering rates of the different materials for up to several hundred hours of operation. The cathode base plate of a composite cathode can be repeatedly used in successive operations with new material to be sputtered.

REFERENCES:
patent: 3324019 (1967-06-01), Laegreid et al.
patent: 3361659 (1968-01-01), Bertelsen
patent: 3652444 (1972-02-01), Lester et al.
Kay et al, "Controlled Sputtering Process", IBM Technical Disclosure Bulletin, vol. 12, No. 9, Feb. 1970, p. 1358.
Hanak, "Compositional Determination of rf Co-Spattered Multicomponent Systems", J. of Vac. Sci. and Tech., vol. 8, No. 1 (Jan-Feb. 1971, pp. 172-175).

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