Apparatus for coating substrates by cathode sputtering with a ho

Details Apparatus for coating substrates by cathode sputtering with a ho Apparatus for coating substrates by cathode sputtering with a ho

1997-02-19

1998-02-10

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429809, 20429815, 20429816, 20429821, 20429828, C23C 1434

Patent

active

057165050

ABSTRACT:
A pot-shaped hollow target (4) open toward the substrate (3) to be coated is surrounded by a dark-space shield (7) adjacent the lateral wall (5) of the target (4), and a cathode base body (11) is supported on an insulator (9) on the roof (10) of the vacuum chamber (2) and connected electrically to a power source (6). A hanger (15) reaches through a central opening (12) in the cathode base body (11) and through a central opening in the top (8) of the target (4) and is supported on the cathode base by an insulator (14), and holds a disk (16) shielding the top (8) of the target (4). A motor-driven turntable (18) forms the substrate holder (17), whose axis of rotation (19) is parallel to but offset laterally from the plane of symmetry (20) of the target by an amount (A).

REFERENCES:
patent: 4933064 (1990-06-01), Geisler et al.
patent: 5069770 (1991-12-01), Glocker
patent: 5417834 (1995-05-01), Latz
patent: 5423971 (1995-06-01), Arnold et al.
patent: 5482611 (1996-01-01), Helmer et al.
Hieber, K. "Radio-Frequency Sputter Deposition of Alloy Films."-Siemens Forsch. - u. Entwickl.-Ber., Bd. 11, 1982, Nr. 3, S. 145-148.
Horwitz, C. "Rf sputtering-voltage division between two-electrodes", J. Vac. Sci. Technol. A, 1(1), Jan.-Mar. 1983, S.60-68.

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