Apparatus for coating substrates by cathode sputtering with a ho

Details Apparatus for coating substrates by cathode sputtering with a ho Apparatus for coating substrates by cathode sputtering with a ho

1997-02-19

1998-03-17

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429811, 20429823, 20429828, 20429825, C23C 1434

Patent

active

057282803

ABSTRACT:
A pot-shaped hollow target (4) is open toward the substrate (3) that is to be coated, a dark-space shield (6) surrounds the lateral wall (5) of the target (4), and a cathode base body (11) is supported on an insulator (8) on the roof (9) of the vacuum chamber (2) and is connected electrically to a power source (10). A magnet belt (12) formed of a plurality of magnets (18, 18') surrounds the dark-space shield (6). A turntable (15) having an axis of rotation (16) parallel to and offset from the target's (4) perpendicular plane of symmetry (17) is provided for holding the substrates (3).

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patent: 5482611 (1996-01-01), Helmer et al.
Hieber, K. "Radio-Frequency Sputter Deposition of Alloy Films".-Siemens Forsch. -u. Entwickl.-Ber., Bd. 11, 1982, Nr. 3, S. 145-148.
Horwitz, C. "Rf sputtering-voltage division between two-electrodes", J. Vac. Sci. Technol. A, 1(1), Jan.-Mar. 1983, S.60-68.

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