Apparatus for coating substrates

Coating apparatus – With cutting – punching or tearing of work – Web or sheet work

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118503, C23C 1312

Patent

active

040107108

ABSTRACT:
A metal coating is deposited upon the surface of a number of electronic circuit device wafers in an evacuated chamber by means of tooling that rotates the wafers about three different axes. A primary three-armed spider rotates about a primary axis and carries on each of its arms a four-armed secondary spider holding a wafer on each of its arms. Four of such primary spiders together with the secondary spiders mounted thereon are carried respectively by four upright standards that rotate in unison about a vertical axis of a cloud of metal vapor filling the chamber. Rotation of the standards causes rotation of the primary spiders relative to the standards and also rotation of each secondary spider relative to its primary spider. The arrangement causes each wafer to sweep up and down along outer portions of the metal vapor cloud as it rotates about the vertical axis of the cloud and also causes each wafer to rotate about its own axis several times for each up and down sweep. An optimum acute angle between the surface of each wafer and a line from the wafer to the source of metal vapor cloud remains within a narrow range during all motion and at all positions of each wafer.

REFERENCES:
patent: 3486237 (1969-12-01), Sawicki
patent: 3598083 (1971-10-01), Dort et al.
patent: 3853091 (1974-12-01), Christensen et al.
patent: 3858547 (1975-01-01), Bergfelt
IBM Technical Disclosure Bulletin, "Planetary Evaporation System Having Multiple Rotations," Lee, vol. 16, No. 9, [Feb. 1974], pp. 2865-2868.

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