Apparatus for coating semiconductor components on a dielectric f

Details Apparatus for coating semiconductor components on a dielectric f Apparatus for coating semiconductor components on a dielectric f

1988-06-28

1989-09-05

Hoag, Willard

Coating apparatus

With means to apply electrical and/or radiant energy to work...

118 58, 118209, 118314, 118324, 118642, B05C 502, H05K 312, H05K 322

Patent

active

048628271

ABSTRACT:
Apparatus for applying a coating to semiconductor chips mounted within apertures in a dielectric film. The film containing the semiconductor chips and input-output connectors is fed from a reel past an applicator for applying the coating on one side of the chips. After passing through a curing chamber, the film passes about a substantially square sprocket so as to reverse the direction of travel. The sprocket is of such a dimension that the film bends on a line between each individual chip or a selected group of chips. The strip then passes by another applicator for coating the other side of the chips. After passing through the curing chamber, including a substantially square sprocket, the film is wound on a driven sprocket. The coating may be a silicone composition, an epoxy resin, or a urethane composition.

REFERENCES:
patent: 613756 (1898-11-01), Buddle
patent: 1963314 (1933-04-01), Savell et al.
patent: 3738315 (1973-06-01), Sweitzer
patent: 3991710 (1976-11-01), Gourdine et al.
patent: 4219926 (1980-09-01), Bloch et al.
patent: 4265954 (1981-05-01), Romanek
patent: 4343083 (1982-08-01), Takemura et al.
patent: 4397074 (1983-08-01), Thornton et al.
patent: 4411982 (1983-10-01), Shibuya et al.
patent: 4419803 (1983-12-01), Thornton et al.
patent: 4438723 (1984-03-01), Cannella et al.
patent: 4441245 (1984-04-01), Thornton et al.
patent: 4465543 (1984-08-01), Sadamasa et al.
patent: 4606117 (1986-08-01), Takahashi et al.
patent: 4611554 (1986-09-01), Mahlkow et al.
patent: 4636405 (1987-01-01), Mensah et al.
patent: 4644899 (1987-02-01), Glaus
patent: 4763409 (1988-08-01), Takekawa et al.

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