Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1991-05-09
1992-12-01
Nguyen, Nam X.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419212, 20429819, 20429803, C23C 1434
Patent
active
051677890
ABSTRACT:
In an apparatus for coating a substrate (1) with electrically conductive materials (2), comprising a direct-current and/or an alternating-current source (10 and 38, respectively), which is connected to an electrode disposed in an evacuable coating chamber (15, 15a, 15b) electrically connected with a target (3, 32) which is sputtered and whose sputtered particles deposit themselves on the substrate (1), a process gas can be put into the coating chamber (15, 15a, 15b), toroidal magnetic fields pass through the target and their lines of force issue from the surface of the target (3) at the magnet poles, the target (3) has a substantially elongated, flat, oval shape and is furthermore surrounded by a dark-space shield (34) whose circumferential edge facing the substrate (1) slightly overreaches the front surface of the cathode tub (4), while the magnet system held on a yoke (6) and disposed in the cathode tub (4) is formed of a middle series of narrow magnets (8) extending in the direction of the length of the target, an additional series of narrow magnets (7, 9) disposed on the marginal part of the yoke (6), and two round magnets which are situated one on each end of the middle series of magnets (8).
REFERENCES:
patent: 4734183 (1988-03-01), Wirz et al.
patent: 4927513 (1990-05-01), Schultheiss et al.
patent: 4931169 (1990-06-01), Scherer
patent: 5026471 (1991-06-01), Latz et al.
Leybold Aktiengesellschaft
Nguyen Nam X.
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