Apparatus for cleaning workpieces by ultrasonic energy

Cleaning and liquid contact with solids – Apparatus – Electrically controlled

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Details

134148, 134149, 134184, B08B 302

Patent

active

040648850

ABSTRACT:
A delicate workpiece, such as a semiconductor wafer is cleaned by supporting the workpiece on a shaft which is rotated. A film of liquid solvent is caused to continuously flow across the exposed workpiece surface while the workpiece is in rotation and ultrasonic energy is applied to the liquid film for causing cavitation in the solvent, thereby effecting cleaning of the workpiece surface. Upon shutting off the solvent and the ultrasonic energy, the workpiece is dried by spinning it at high speed.

REFERENCES:
patent: 2850854 (1958-09-01), Levy
patent: 2938732 (1960-05-01), Mantell, Jr.
patent: 2994329 (1961-08-01), Catlin et al.
patent: 3401708 (1968-09-01), Henes
patent: 3829328 (1974-08-01), Blustain
Jensen, E. W., "Polishing Silicon Wafers", Geoscience Instruments Corp., 1966, pp. 1, 2, 9.

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