Cleaning and liquid contact with solids – Apparatus – With means to movably mount or movably support the work or...
Reexamination Certificate
2007-09-18
2007-09-18
Stinson, Frankie L. (Department: 1746)
Cleaning and liquid contact with solids
Apparatus
With means to movably mount or movably support the work or...
C134S157000, C134S198000, C134S902000
Reexamination Certificate
active
10450430
ABSTRACT:
The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (CO2particles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.
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Kim Jung-Gwan
Ko Se-Jong
Lee Jeong-Ho
Yoon Cheol-Nam
K. C. Tech Co., Ltd.
Osha & Liang LLP
Stinson Frankie L.
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