Apparatus for cleaning semiconductor wafers

Details Apparatus for cleaning semiconductor wafers Apparatus for cleaning semiconductor wafers

1981-05-15

1983-08-30

Bleutge, Robert L.

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

134184, B08B 312

Patent

active

044011318

ABSTRACT:
The cleaning apparatus disclosed herein employs ultrasonic energy applied through a transducer face which overlies the entire wafer face. A cleaning liquid is introduced through the center of the transducer faceplate into the gap between the wafer and the faceplate. The transducer includes a plurality of piezoelectric transducer elements annularly distributed around the faceplate which are energized for synchronous vibration to provide an essentially uniform acoustic field over the faceplate. The faceplate is essentially flat over a majority of its surface but includes a plurality of grooves facilitating the venting of vapors created by cavitation during cleaning.

REFERENCES:
patent: 3445092 (1969-05-01), Fierle et al.
patent: 4064885 (1977-12-01), Dussault et al.
patent: 4103519 (1978-08-01), Davidson
patent: 4183011 (1980-01-01), Massa
patent: 4326553 (1982-04-01), Hall
Jensen, "Polishing Silicon Wafers", 1966, (See FIGS. 1 & 2 on p. 9).

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