Apparatus for clamping printed circuit boards inside an...

Details Apparatus for clamping printed circuit boards inside an... Apparatus for clamping printed circuit boards inside an...

2007-01-16

2007-01-16

Tugbang, A. Dexter (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S281100, C029S825000, C029S830000, C029S831000, C029S834000, C269S266000, C361S752000, C361S760000, C361S797000, C361S800000, C361S801000, C361S802000

Reexamination Certificate

active

10703819

ABSTRACT:
Reflow soldering of a variety of circuit boards (9, 11, 15) in a variety of sizes and shapes to assigned locations on the base or carrier (13) of the electronic module housing (3) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled (22) with particulate, such as small beads (17), covering the circuit boards, but leaving the edges of the upstanding metal shields (5and7) visible. A plate (21) backed foam sheet (19) is placed over the module housing (24) and clamped down (26), pressing against the beads. The clamped assembly is then heated (28) to reflow the solder, soldering the circuit boards in place.

REFERENCES:
patent: 4080729 (1978-03-01), Mecklenburg, III

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