Apparatus for circuit encapsulation

Details Apparatus for circuit encapsulation Apparatus for circuit encapsulation

1997-02-20

1999-08-31

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

And means to form or reshape preform

425116, 4251291, 425544, 425553, 56427215, 56427217, 564276, B29C 4505, B29C 4514

Patent

active

059451300

ABSTRACT:
A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.

REFERENCES:
patent: 2669753 (1954-02-01), Hormann
patent: 2724864 (1955-11-01), Krotz
patent: 2937409 (1960-05-01), Cole
patent: 3238287 (1966-03-01), Chapman
patent: 3354529 (1967-11-01), James
patent: 3408438 (1968-10-01), Staunton
patent: 3539675 (1970-11-01), Hugill
patent: 3621338 (1971-11-01), Rogers et al.
patent: 3683241 (1972-08-01), Duncan
patent: 3737729 (1973-06-01), Carney
patent: 3769702 (1973-11-01), Scarbrough
patent: 4029388 (1977-06-01), Knoll
patent: 4218724 (1980-08-01), Kaufman
patent: 4336009 (1982-06-01), Wolf
patent: 4400762 (1983-08-01), Bartley et al.
patent: 4528749 (1985-07-01), Heft
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4554613 (1985-11-01), Kaufman
patent: 4615847 (1986-10-01), Baird
patent: 4688152 (1987-08-01), Chia
patent: 4691265 (1987-09-01), Calver et al.
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4724514 (1988-02-01), Kaufman
patent: 4736520 (1988-04-01), Morris
patent: 4740414 (1988-04-01), Shaheen
patent: 4750089 (1988-06-01), Derryberry et al.
patent: 4750092 (1988-06-01), Werther
patent: 4769525 (1988-09-01), Leatham
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4783697 (1988-11-01), Benenati et al.
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4861251 (1989-08-01), Moitzger
patent: 4868349 (1989-09-01), Chia
patent: 4879630 (1989-11-01), Boucard et al.
patent: 4881884 (1989-11-01), De'Ath
patent: 4899257 (1990-02-01), Yamamoto
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5028987 (1991-07-01), Neugebauer et al.
patent: 5206986 (1993-05-01), Arai et al.
patent: 5326243 (1994-07-01), Fierkins
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5344600 (1994-09-01), McShane et al.
patent: 5356283 (1994-10-01), Hamada et al.
patent: 5365403 (1994-11-01), Vinciarelli et al.
patent: 5375322 (1994-12-01), Leeb
patent: 5395226 (1995-03-01), Sakai et al.
patent: 5626887 (1997-05-01), Chou et al.
patent: 5637273 (1997-06-01), Goo
Electronic Products, "Ball grid array package challenges quad flatpack", p. 19, APr. 1993.

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