Apparatus for chemically etching substrates

Details Apparatus for chemically etching substrates Apparatus for chemically etching substrates

1995-06-06

1997-03-25

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 92, 134 64R, 134122R, 134199, C23F 102, B08B 300

Patent

active

056140568

ABSTRACT:
An apparatus for chemically etching the copper foil of a copper foil-clad substrate are disclosed. Significantly, this apparatus includes fluid jet injectors which serve to produce jets of chemical etchant. These fluid jet injectors are arranged so as to simultaneously achieve a relatively high etch rate and a relatively high etch uniformity.

REFERENCES:
patent: 4917758 (1990-04-01), Ishizuka et al.
patent: 5063950 (1991-11-01), Kallweit et al.
patent: 5188135 (1993-02-01), Neumann et al.
patent: 5289639 (1994-03-01), Bard et al.
patent: 5435885 (1995-07-01), Jones et al.

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